Researchers developed a room-temperature, maskless electrodeposition method for directly 3D-printing freestanding copper microinductors onto chip contact pads, enabling inductance to be generated without requiring additional dedicated planar silicon area. The printed microsolenoids achieved nanohenry-range inductance, quality factors up to 18, and experimentally validated inductive behavior up to 15 GHz, supporting their potential for post-fabrication integration into future RF electronics.
