[ASAP] Surface-Treated Three-Dimensional Boron Nitride Epoxy Composite Dielectric for Smartphone-Printed Circuit Board Application LikeLiked Carbon Daddy Date: December 26, 2024 Less than 1 MinRead Views: 34 ACS Applied Engineering Materials DOI: 10.1021/acsaenm.4c00701 Source: http://dx.doi.org/10.1021/acsaenm.4c00701 FacebookTwitterLinkedinWhatsAppTelegramEmail ALT-Lab-Ad-1ALT-Lab-Ad-2ALT-Lab-Ad-3ALT-Lab-Ad-4ALT-Lab-Ad-5ALT-Lab-Ad-6ALT-Lab-Ad-7ALT-Lab-Ad-8ALT-Lab-Ad-9ALT-Lab-Ad-10ALT-Lab-Ad-11ALT-Lab-Ad-12ALT-Lab-Ad-13 Recent Articles Characterization of a novel Dye-Decolorizing peroxidase from Brevibacillus agri and its application in detoxification of textile industry wastewater Research October 16, 2025 Kovo 11 Park / Inout.designstudio Built Environment October 16, 2025 Life cycle assessment of an Australian higher education institution – The case study of the Queensland university of technology Research October 16, 2025 Melville / Tan Architecture Built Environment October 16, 2025 Different paths lead to the same destination: a highly efficient TMSOTf/HFIP catalytic system for large-scale synthesis of fluoroalkyl-containing 4,4′-methylenedianiline (MDA) monomers Research October 16, 2025 Design and synthesis of biobased superhydrophobic biochar catalyst derived from Citrus sinensis for biodiesel production using inedible oil feedstocks Research October 16, 2025 Rolling planning-based closed-loop supply chain logistics model under an unstable demand scenario Waste Management October 15, 2025 Reservoir aims to bring more deep tech talent to agtech with new investment vehicle Food & Agriculture October 15, 2025 Precision Ag News 10/15 Food & Agriculture October 15, 2025 Fusionware Expands Team to Support Produce Industry Food & Agriculture October 15, 2025 Load more