AdvancedPCB Expands HDI Capability in Silicon Valley with Advanced Vacuum via Filling Technology

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Date:

February 16, 2026

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AdvancedPCB has installed a MASS VCP-5000 Vacuum Via Filling System at its Santa Clara facility, increasing capacity for advanced HDI and high-reliability printed circuit board builds in Silicon Valley.

Source: https://www.azom.com/news.aspx?newsID=65213

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Materials Industry

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