Element Six Unveils Groundbreaking Copper Diamond Composite to Power Advanced Semiconductor Devices

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Date:

February 3, 2025

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New Copper Diamond Composite Material Provides a Cost-Effective, High Performance Thermal Management Solution for AI, HPC, and GaN Radio Frequency (RF) Devices.

Source: https://www.azom.com/news.aspx?newsID=64187

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Materials Industry

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Element Six Unveils Groundbreaking Copper Diamond Composite to Power Advanced Semiconductor Devices

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