Forge Nano, Inc., a leading U.S. based semiconductor equipment and advanced materials company pioneering Atomic Layer Deposition (“ALD”) technology for artificial intelligence (“AI”)-era chip manufacturing and defense battery applications, which has signed an agreement to merge with Archimedes Tech SPAC Partners II Co. (“Archimedes II”), today announced the delivery of its TEPHRAâ„¢ semiconductor wafer fabrication tool to a leading Fortune Global 500 communications infrastructure company for advanced photonics applications.
